Exact(3)
Here gold is used to prevent oxidation and titanium is introduced to avoid the diffusion of gold into the aluminium layer.
Lead is used as a sleeve material to avoid the diffusion and penetration of CO2 through the rubber core sleeves.
Accordingly, we used an HI-6 concentration that is at least 100-fold higher than its KD (∼100 µM) for HI-6sarinnonaged-mAChE to avoid the diffusion problem, and ran a time-course experiment to find the shortest HI-6-exposure time that can minimize the unwanted reactivation and aging and still yield a good-quality electron density map.
Similar(57)
Ideal tissue engineering designs avoid the diffusion-limited regime such that attached cells are exposed to all of the ingredients required for proliferation everywhere within a regenerative matrix.
These findings suggest that targeting of GECIs to the ER outer membrane enables sensitive detection of Ca2+ release from the ER at subcellular resolution, avoiding the diffusion of GECI and Ca2+.
Lower temperatures with shorter anneals become particularly important for avoiding the diffusion of metals from contacts, and potentially reducing the number of design steps required compared to the typically longer quartz tube furnace annealing.
Furthermore, there are some other advantages of TiO2 such as easily fabricated, no pollution, fully compatible with CMOS process, and avoids the diffusion between phase change material and bottom electrode.
As the results showed, 120 mL/min is sufficient to avoid the external mass diffusion, and the internal diffusion is negligible when the particle size is lower than 0.075 mm.
Opening such a lunchbox in an enclosed space is not a good idea, so I'd gently ease open the corner of my Tupperware box and snatch something out quickly (like Indiana Jones grabbing his hat from under the closing door in the Temple of Doom) to avoid the risk of diffusion.
Furthermore, the fourth-order central difference scheme is adopted for spatial discretization to avoid the numerically implicit diffusion that would be induced by odd-ordered difference schemes.
Finally, the integration of nitride technology in devices may require lower growth temperature to avoid the potentially detrimental diffusion of species during processing.
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Justyna Jupowicz-Kozak
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