Sentence examples for assembly schemes from inspiring English sources
In Fig. 7, the assembly schemes are organized in an ideogram with procedures step by step as well as necessary operations to carry out the assembly process.
Using this approach, many assembly schemes can be inexpensively evaluated for their ability to deliver the important characteristics of the final product.
The software allows process designers to analyze candidate assembly schemes and achieve the best assembly process design prior to having detailed knowledge of geometry of the parts, and thus is ideal for architectural process design.
In the past few years, novel assembly schemes, such as Flip Chip, 3D assemblies, and advanced low-k/ultralow-k dielectric materials have been introduced in the semiconductor industry.
Assembly-oriented design (AOD) is a new approach to designing assemblies, which uses a number of design and analysis tools to help the designer plan out and analyze candidate assembly schemes prior to having detailed knowledge of the geometry of the parts.
The results on both simulated and real data sets demonstrate that the proposed algorithm, named SDhaP, has higher accuracy and is significantly faster than the existing haplotype assembly schemes.
12.29pm: Investment in skills In response to a question from Labour's Hywel Francis, Brown says he is studying a Welsh assembly scheme to help people acquire new skills while they are still in work.
An integrated assembly scheme utilizing space robots to realize this platform SSPS concept is presented.
We also prepared PAni/rGO multilayer pseudocapacitors by varying rGO weight loading by electrostatic LbL assembly (Scheme 2) and compared their electrochemical properties with those of Scheme 1.
Detail design of the flexible supports and keys to support blanket modules has also progressed considering electrical insulation and assembly scheme.
The primary distinctive feature of this sensor is the direct silicon to PCB (Printed Circuit Board) assembly scheme, effectively decomposing the incoming force vector into three independent components while eliminating the needs for complex micro fabrication and chip packaging.
