Sentence examples for are further interconnected from inspiring English sources

Exact(4)

The duplexes are further interconnected through intermolecular hydrogen bonds to form a layer of peptides.

The adjacent layers are further interconnected via π-π interactions between the 2,2-bipy ligands exhibiting an interesting 3D supramolecular architecture.

These 1D chains are further interconnected via hydrogen bonds among non-coordination carboxylate groups and arsonate oxygens into a 3D supramolecular architecture.

Although compounds 1 3 have a same M/L ratio (1 1), they exhibit totally different structures.Compound 1 has a linear chain structure, in which each pair of square-pyramidal coordinated copper II) ions are bridged by two phosphonate oxygen atoms to form a Cu2O2 dimeric unit, and such dimeric units are further interconnected via phosphonate groups to form a [010] chain.

Similar(56)

The radio equipment of first responders in each disaster site forms an ad hoc network that is further interconnected to a headquarter via satellite access.

Cd-MOF is a 2D infinite layer framework, which is further interconnected by hydrogen-bond interactions leading to a 3D supramolecular architecture.

Compound 1 possesses an infinite 1D ladder-like chain structure with [Zn(H2O 6]2+ trapped in the pores, which is further interconnected by π⋯π interactions to lead to a 2D supramolecular architecture.

By altering the demixing process at selected evaporation temperatures, i.e. 60 80 °C, the pore structure of membranes cast from mixed solvent systems can be further designed into the desired interconnected open pore structure rather than globular structure with weaker mechanical strengths.

Our utilized interconnect is further barely affecting the critical path of memory accesses.

When a large cluster cannot be further split into overlapping sub-graphs of highly interconnected nodes, it can be split into independent sub-graphs of highly interconnected nodes.

From this we can conclude that the CNT growth has no significant impact on the electrical devices, although the resistance of the CNT should be further reduced to compete with metal interconnects.

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