The phrase "are capable of depositing" is correct and usable in written English.
You can use it when describing the ability of a person, organization, or system to place or transfer something, typically in a financial or physical context.
Example: "The new software features allow users to manage their accounts more efficiently, as they are capable of depositing funds directly from their mobile devices."
Alternatives: "have the ability to deposit" or "are able to deposit".
Hydrates are capable of depositing along the line causing flow restriction.
Thus, the multiple-cantilever SPTs can function as pre-loaded, ready-to-print biomolecular ink cartridges and are capable of depositing multiple proteins simultaneously with uniform spot sizes and protein coverage.
The purpose of this study is to investigate whether cyanobacteria possess light-dependent electrogenic activity (i.e. are capable of depositing electrons to the extracellular environment in response to illumination), to test whether the electrogenic activity is generic and to probe the mechanism of the electrogenic response.
Similar to asbestos, inhaled mineral wool and glass fibre particulates are capable of depositing deep within the lungs, due to their needle-like dimensions, reaching the alveoli, and provoking macrophages to attack (Agency for Toxic Substances and Diseases Registry, http://www.atsdr.cdc.gov/toxprofiles/tp61.pdf and http://www.atsdr.cdc.gov/toxprofiles/tp161.pdf).
It was also demonstrated that the SPPS process is capable of depositing thick (>2 mm) and durable TBCs.
This diverse range of applications requires the launchers to be capable of depositing the EC power across nearly the entire plasma cross section.
The reference gas box liner (GBL) formed by chevron shaped tungsten tiles is capable of depositing and/or recombining only 5% of the carbon impurities.
PS-PVD is capable of depositing from the vapor phase to yield strain tolerant columnar microstructures similar to Electron Beam – Physical Vapor Deposition (EB-PVD) or, alternatively, the traditional splat-like lamellar microstructure common to Air Plasma Spray (APS).
The proposed bath is capable of depositing Sn Ag Cu films having near eutectic composition that remains consistent even with increase in current density beyond 5 mA cm− 2.
The system is capable of depositing at rates between <0.001 nm/s and >0.5 nm/s measured at a distance of 100 mm for Cu clusters.
The results implied that the ALD technique was capable of depositing homogeneous nano-oxide thin films on substrates with a complex structure, such as glass MCP.
