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The shear strength of the Cu Cu joint was determined by a Micro Materials Testing Platform at a testing speed of 5 mm/min, and the test value of the bonded joint reaches the shear strength of 31.88 MPa, which is a high value for microelectronics packaging [15, 16].
For the DNA data, θ will be increased, and the test value will be significantly negative.
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Surprisingly, although our study included more markers and animals, the QTL significance was lower, which could be explained by the fact that using only extreme animals artificially increased the QTL effect and therefore the test value [ 21].
The established model in this paper was verified effectively by contrast of the calculation values of the fatigue whole life model and the test values.
The relationship between the response and the test values was analyzed with a linear regression.
Because of the inverse relation between mRNA level and CT, we subtracted the test value from the control value.
The level of C determines which test value cutoff will be used in deriving up-regulated genes, and this will be the test value that have been derived for < C% of the genes (pseudo code shown in Fig. 7).
Fig. 3 a The schematic diagram of shear strength test and the tested value of the bonded joint and the aged joint.
Figure 3a shows the schematic diagram of shear strength test and the tested value of the bonded joint and the aged joint.
The stiffness and strength design values match the test values very well.
Our criteria for statistical equivalence in the heat and light stress experiments required that the test values be statistically equal to or greater than the control values.
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