The restandardized enrichment score (RES) used is defined as: (1) where are the mean and standard deviation of ES† and are the corresponding quantities based on label permutations.
Brain mass (W) is determined by the total number of neurons and supporting cells; hence W = Nw+ N 1 w 1, where N and w are the number and weight of brain neurons, respectively, and N1 and w1 are the corresponding quantities for the supporting cells.
The relations describing these changes are where L0 and T0, called proper length and proper time, respectively, are the values measured by an observer on the moving body, and L and T are the corresponding quantities as measured by a fixed observer.
Relevant components of the Nye tensor are calculated from atomic positions in the dislocated crystal, represented by contour plots, and contrasted with the corresponding quantities obtained from a local continuum model.
Transformation rules are given that take the concentration or current expressions for the simple irreversible electron-transfer reaction R → P + e− and convert them to the corresponding quantities for the quasireversible reaction.
The self-diffusion of water and oil were normalized with the corresponding quantities obtained from a polymer-free system to make it possible to compare the polymer-free microemulsion with systems with polymer.
In addition to the wanted and interfering signal components on subcarrier k, h++, and h+−, we now also treat the corresponding quantities on the mirror subcarrier −k.
It was found that the activation energies of Case I and Case II transport of mixture are equal to the summation of the corresponding quantities for methanol and ethanol with each weight factor based on the respective volume fraction.
It has been shown that these quantities can be expressed using the corresponding quantities of the signal and window as [4] 〈 t 〉 SP = 〈 t 〉 ( s ) − 〈 t 〉 h 〈 ω 〉 SP = 〈 ω 〉 ( s ) + 〈 ω 〉 h T SP 2 = T s 2 + T h 2 B SP 2 = B s 2 + B h 2. (15).
Accordingly, the stresses and energy release rate (ERR) in the adhesive layer – responsible for the premature cracking of the adhesive and debonding of the IC chips – are identified with the corresponding quantities computed for the elastic interface.
