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In this paper, reliability of Through Silicon via (TSV) interconnects is analyzed for two technologies.
Design and operating characteristics are analyzed for two pilot scale reverse osmosis plants.
The nonlinear behaviour is analyzed, for two flowsheet alternatives and four plantwide control structures.
Mass transfer enhancement by carrier transport is analyzed for two independent carrier species in parallel.
The trends of interfacial fracture toughness were analyzed for two specific orientations (100) and (110).
PMP and PMF were separately analyzed for two seasons: summer-fall and spring.
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The convective diffusive equations are analyzed for two-dimensional and axisymmetric geometries in the limit of high Re, narrow slits, small aerosol to sheath air flow ratios, and negligible space charge.
All cells were analyzed for two-colour cytometry staining on a FACScalibur instrument (Becton Dickinson, Mountain View, CA) and data analysis was performed with CellQuest software (Becton Dickinson).
Data were analyzed for two-point and multipoint linkage with the IMpRH mapping tool and submitted to the IMpRH web server (http://imprh.toulouse.inra.fr/; [ 47]).
Data were analyzed for two-point and multipoint linkage with the IMpRH mapping tool [ 44] and submitted to the IMpRH database [ 45].
Effect sizes were separately meta-analyzed for two-group comparison studies (SMD = 0.20), pre-post contrast studies (ESsg = 0.62), and associational studies (r = −0.06), in the fixed-effect model.
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