The phrase "alignment condition" is correct and usable in written English.
It can be used in contexts related to mathematics, engineering, or any field where specific conditions for alignment are discussed.
Example: "The alignment condition must be satisfied to ensure the components fit together properly."
Alternatives: "alignment requirement" or "alignment criteria".
The best alignment condition is finally identified finding the values of the pose p that minimize the RMSD with the Levenberg Marquardt (LM) method [35]: (5).
Condition (2) is called the equidistribution condition and determines the size of element K, while condition (3) is called the alignment condition and characterizes the shape and orientation of K.
The underlying physics is that the longitudinal gradient in field-line-integrated Pedersen conductivity becomes steepest, so eastward polarization electric field, corresponding to vertical plasma drift, is enhanced under the alignment condition.
These may include the number of dowels under the load, the contribution of dowel bars and aggregate interlock for LTE and differential deflection, and/or dowel bar alignment condition.
The design principles of TMO window layer in amorphous Si solar cells are summarized as follows: A wide optical bandgap larger than 3.0 eV, a high work function larger than 5.2 eV, and a band alignment condition rendering efficient hole collection from amorphous Si absorber layer.
In this work, we present a new distributed adaptive iterative learning control (AILC) scheme for a class of high-order nonlinear multi-agent systems (MAS) under alignment condition with both parametric and nonparametric system uncertainties, where the actuators may be faulty and the control input gain functions are not fully known.
For example, the optimal alignment conditions for the V6 region aligned each of the candidate sequences completely.
This paper focuses on the investigation of different control methods for overcoming these detrimental alignment conditions.
Experimentally-verified computational models provide an efficient platform for analysis of multiple components, sizes, and alignment conditions.
Based on these calculation results, the alignment quality was optimized and the whirling vibration characteristic under different alignment conditions was calculated.
For SONOS CT memory devices, the erase current is composed of electron detrapping and hole injection currents, depending on the band alignment conditions.
