The phrase "abrasive cutting" is correct and usable in written English.
It can be used in contexts related to manufacturing, machining, or materials processing where a cutting method involves abrasive materials to remove material from a workpiece.
Example: "The technician explained that abrasive cutting is often preferred for hard materials due to its efficiency and precision."
Alternatives: "abrasive machining" or "abrasive machining process".
The model of two SiC abrasive cutting monocrystal copper with different angles was constructed.
Fig. 2 Simulation model of SiC abrasive cutting single crystal copper.
Figure 2 is about the simulation model of SiC abrasive cutting single crystal copper; we built two SiC abrasive for cutting single crystal copper.
The number of the workpiece atoms along the abrasive grain motion direction also increases, and the atomic displacement is perpendicular to the direction of abrasive cutting.
Upon increasing the abrasive cutting force, beyond the critical value (atom binding force), the atomic lattice damaged and the bonds dissociate which result an amorphous structure.
Figure 6 shows SiC abrasive cutting force and the cutting angle and simulation step diagram, with increasing cutting depth, the number of the crystal structure of destruction increases, the maximum value of the fluctuation of cutting force also becomes larger.
Due to the movement of these abrasive particles, the copper atoms accumulated at the tip of the abrasive grains, which results no cracks during abrasive particles cutting.
The material removal tests were conducted using a computer numerical control (CNC) abrasive jet cutting machine for different parameters of nozzle feed rate (10, 15, 20 and 25 mm·min−1), abrasive flow rate (50, 150, 250 and 350 g·min−1), spindle speed (25, 50, 75 and 100 min−1) and standoff distance (2, 5, 8 and 11 mm).
They're full of fractured hip-hop pastiche in the tradition of left-field hip-hop like Ultramagnetic MCs and Company Flow — particularly the self-titled one, which is more abrasive and cutting, and better, than its companion piece.
In the process of abrasive flow cutting, the cutting force increases as the cutting speed increases, and the size of the cutting force directly affects the cutting effect.
In the process of abrasive grain cutting of single crystal copper workpiece, the kinetic energy of the system is closely related to the work done of the workpiece material by SiC abrasives.
