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Thin solid films of zirconia were deposited on solid and porous substrates over a range of deposition conditions by the pulsed-pressure metalorganic chemical vapor deposition (PP-MOCVD) process.
As-machined type 304L stainless steel substrates were coated over a range of deposition temperatures from 450 °C to 800 °C.
Solid nickel, co-sintered nickel cermet and [100] P-type silicon were investigated as substrates for a range of deposition conditions.
Also noted was a range of deposition patterns, such as filamentous aggregates containing both tightly packed and loose filaments (Fig. 5d and e), or non-filamentous tau based upon strong immunolabeling with E1 antibody that was diffusely distributed throughout the cytoplasm, which may represent 'pre-tangle' pathology (Supplementary Material, Fig. S4a and b).
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Previous studies examined ways of achieving a high uniformity of deposit using a range of different deposition techniques, such as pulse laser deposition [3], chemical beam coating [4], vacuum arc deposition [5], and plasma enhanced chemical vapor deposition.
This approach is an extremely versatile method for the deposition of particles into a porous TiO2 network, allowing a range of nanoparticle deposition concentrations to be achieved, which also show an even distribution across the depth of the film.
Secondly, under a wide range of deposition conditions, a bimodal distribution of islands (shallow {105} pyramids and steeper, multifaceted domes [4, 5]) is obtained.
Therefore, the former abrupt change in the value of the anisotropy field in such a narrow range of deposition angles presented a drawback for the desired accurate control over the value of the anisotropy field.
For examining a wide range of deposition parameters, we use a design-of-experiments approach.
Nanosheets were obtained without catalyst over a wide range of deposition conditions and on a variety of substrates, including metals, semiconductors and insulators.
Unlike the co-electrodeposition of copper-zinc-tin, the electrodeposition of stacked metal layers allows precise control of the quantity deposited and is effective under a large range of deposition conditions of temperature, pH, and concentration of the main salt or addition agent.
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