The phrase "a minimum grain" is correct and usable in written English.
It can be used in contexts discussing quantities, measurements, or standards, particularly in fields like agriculture, cooking, or manufacturing.
Example: "To ensure the best quality, the recipe requires a minimum grain of salt to enhance the flavor."
Alternatives: "a small amount" or "a basic quantity".
It is well-documented that during milling, the grain size decreases with milling time, reaching a minimum grain size, dmin, which is a characteristic of each metal.
Most grain models adopt a minimum grain radius of a few × 10−8 cm (Weingartner and Draine, 2001; Guillet et al., 2009) although applying bulk material properties to such small grains could cause a large uncertainty.
The typical grain size of region I is 1 cm with a minimum grain size of the order of 10 μm near the surface.
In Ref. [1] it was suggested that the mobility of the grain boundaries should be the crucial parameter for the occurrence of a minimum grain size during SPD and larger grains become subdivided again by the formation of low-angle grain boundaries (LAGBs).
The occurrence of a distinct minimum grain size for a specific deformation technique at a given temperature and strain rate is confirmed by deforming a material with a starting grain size smaller than the steady-state grain size obtained by a certain SPD process.
Although the stacking fault energy (SFE) is a fundamental variable determining the minimum grain size (dmin) obtainable in severe plastic deformation (SPD) processes, its accurate measurement is difficult.
Estimating the minimum grain size after a certain SPD process is truly a challenging task; however, several attempts with contradicting assumptions have been recently made to predict or model the steady-state grain size [11 15].
The average grain size decreased exponentially with the cryomilling time and reached a minimum average grain size of around 17 nm.
Another model proposed that the minimum grain size is a consequence of recovery and generation of dislocations, with the stacking fault energy being one of the most important parameters for the obtainable steady-state grain size [14,15].
We adopt a multi-scale approach to compute the attainable range of thermal conductivity due to grain-size effect, given maximum and minimum grain sizes and an operating temperature range.
c Linear model deformed by diffusion creep has a constant grain size of 215 (upmu mathrm{m}) (minimum grain size of model W1E).
