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In order to avoid NW formation on the back side of the wafer, it is necessary to cover the backside Si surface with a masking material that prevents Si etching by MACE.
Keep a masking material at hand.
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PMMA is also commonly used as a mask material for electron beam lithography (EBL).
However, to the best of our knowledge, α-Si as a mask material used for the fabrication of nanostructures has not been investigated yet until now.
GaAs/Al0.96Ga0.04As templates were formed by etching patterns into the surface and oxidizing the exposed Al0.96Ga0.04As to form AlOx, which acts as a mask material.
The microspheres were produced by spray drying a mixture of the model compound (famotidine) with taste masking material.
This photoresist was used as the masking material for SiNW formation on confined areas, and it was found to constitute an excellent masking material since it withstands the MACE solution for a long time and it is easily removed with acetone after the end of the process.
The masking material during the electropolishing step was investigated to optimize the release process.
The coded aperture slit pattern and thickness of masking material forming that pattern can both be tuned for optimal resolving power.
In many applications selective attack by the chemical etchant on different areas of the substrate is controlled by removable layers of masking material or by partial immersion in the etchant.
The phase-shift mask of light was represented by φ = 2πΔnh/λ, where λ is the light wavelength, 325 nm, Δn is the refractive index difference, 0.63, between air and the phase-shift masking material (PR, refractive index: 1.63), and h is embossed pattern height.
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