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Increasing the NH3 flow from 1 to 2 sccm leads to a decrease in the deposition rate by a factor of three.
An increase in the concentration of the molybdate ion in the bath leads to an increase in the amount of Mo in the alloys up to 33 35 at.% and to a decrease in the deposition rate.
The authors found an anomalous deposition rate in the initial deposition and four stages were noted: an induction period before the initiation of deposition, an acceleration period with an increase in the deposition rate, a deceleration period with a decrease in the deposition rate and a stationary period at a constant deposition rate.
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Larger decreases in the deposition rate with the temperature were only noticed at lower SiH4 (or higher NH3) flow rates.
A decrease in both deposition rate and phosphorus content in the coating in comparison with the typical for NiP is observed.
At a typical RF power, above 200 W, we observe a decrease in deposition rate at the powered electrode.
The increase in the amount of oxygen in the WG led to the decrease of the deposition rate and formation of the oxide phases from Cu2O to CuO.
The steepness of the C V response of the as-deposited structures first increased with the increase in deposition rate until 60 nm/min and then started decreasing with the further increase in the deposition rate.
In contrast, the deposition rate of Co decreases.
However, over 40% of the study area shows a decreasing trend in deposition rate.
As a function of reactive gas pressure, the deposition rate showed, in general, a logarithmic decrease with increasing pressure.
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Justyna Jupowicz-Kozak
CEO of Professional Science Editing for Scientists @ prosciediting.com