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The application of a blister test for measuring the interfacial fracture energy, Ga, is demonstrated.
The adhesion strength between a porous silver coating and pure barium titanate has been determined here using a blister test.
A blister test and associated analysis was developed to characterize the interfacial adhesion between graphene and substrates to which it has been transferred.
A blister test with associated analysis was developed to characterize the traction-separation relations associated with interactions between graphene and a copper substrate to which it had been transferred.
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And we were off again in a blistering test, a long sprint that required power, stamina and faith.
A shaft-loaded blister test is a common method to measure interface fracture toughness and energy release rate.
Based on the von Kármán plate theory, the mechanics of a shaft-loaded blister test for thin film/substrate systems is studied by considering elastic substrate deformations and residual stresses in these films.
In this study, a novel sample preparation scheme was developed and a unique quasi-static blister test was performed to measure the adhesion energy between as-grown graphene and its copper foil substrate.
We present a theoretical study of shaft-loaded blister test for the determination of the adhesion strength of thin polymer films and coatings to rigid substrates.
The FEA model was validated using constrained blister test measurements showing a good correlation between the experimental and the FEA data.
Blister test was conducted by a device manufactured locally to measured bond strength of asphaltic material.
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