Sentence examples for LED packages from inspiring English sources

Thermal resistance was analytically defined for the LED module with multi LED packages and was confirmed by the experimental data obtained from the thermal transient method.

Heat transfer is crucial to the fabrication of high efficiency light emitting diode (LED) packages.

Three designs of LED packages resulted in significantly different thermal behaviors.

Mid-power LED packages are now widely used in many indoor illumination applications due to several advantages.

The high temperature operating life test was used to find the weakness elements of LED packages with a limiting maximum temperature stress of 125 °C.

For integrated LED packages conforming to our design rules, a 7.1% enhancement of light output intensity is demonstrated and a 5.1 °C reduction of junction temperature given a 700 mA injection current is measured.

Many LED chip and LED package models and modeling techniques have been published recently, but compact thermal modeling of luminaires as multi heat-source system was not yet dealt with in the literature.

The cooling performance of light-emitting diode (LED) package with the application of GF/E composites is enhanced by reducing the temperature of LED lamp about 20.7 °C compared with the application of pure epoxy.

The results in this study could provide a guideline on design for reliability in the high power LED packaging.

To investigate the thermal performance of NiO films, high power LED package was fixed on bare Al and NiO coated Al (NiO/Al) substrates.

The virtual design by numerical simulation to model various accelerated reliability testing conditions is adopted to validate and improve the reliability of the high power LED package.