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The thermal stability of a DNA duplex containing the Q Pa′ pair and the incorporation efficiency of the Pa′ substrate (dPa′TP) into DNA opposite Q by the Klenow fragment of Escherichia coli DNA polymerase I were improved, in comparison with those of the Q Pa pair.
The results revealed that at filler content 3% of organoclay, initiation and propagation interlaminar fracture toughness in mode I were improved significantly by 64%and67%7% respectively, which could be explained by SEM at given weight as well; SEM images showed that in front of the tip, fibers pull out during initiation delamination accounting for fracture toughness improvement.
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