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Shape influences final fabrication cost.
These definitely increase the fabrication cost.
Therefore the fabrication cost can be reduced.
The fabrication cost could drop dramatically in large volume production.
Integration of the proposed MEMS capacitor with the VCO circuits could require an extra fabrication cost.
Therefore, the fabrication cost is low, and the resulting devices are inexpensive.
The rapid growth of 3D printing technologies would reduce the fabrication cost in the near future.
Using alternative materials of Pt in CE is expected to reduce fabrication cost of DSSCs.
Total fabrication cost including materials and power consumption was $53.26/m22 (Table S2 of Supplementary data).
It not only involves high fabrication cost but also limit the size and massive production.
The main drawback of ceramic membranes is its high fabrication cost compared to polymeric membranes.
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