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We report on the significance of thermal expansion mismatch in the heteroepitaxial growth of CdTe on highly lattice-mismatched substrates.
Thermal expansion mismatch therefore must be minimized.
Thermal short and thermal expansion mismatch effects are the key design challenges of an ITPS.
Examples include thermal expansion mismatch between the layers, piezoelectric strains, and strains in shape memory alloys.
This coating exhibits perpendicular cracks due to thermal expansion mismatch between coating and substrate.
This stabilizing effect minimizes the thermal expansion mismatch between interfacial Cu6Sn5 and the Cu substrate.
This behavior is mainly produced by the expansion mismatch between the matrix and the reinforcements.
The proposed method can effectively mitigate the thermal short and thermal expansion mismatch effects of the ITPS simultaneously.
This originates from radial compressive stress due to thermal expansion mismatch and/or the surface roughness of interface.
The tungsten interlayer can reduce the CTE (coefficient of thermal expansion) mismatch in the Invar-SiO2f/SiO2 joint.
The microscopic residual stress caused by the thermal expansion mismatch of the phases also acted as a reinforcement mechanism.
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