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Our study demonstrates interesting characteristics and trends in the publication of radiology research between ECR 2000 and ECR 2010.
FRUM and EcR isoforms are coexpressed in neurons in the CNS during metamorphosis in an isoform-specific manner.
The mechanical properties and microstructure uniformity of the DLC films deposited at different positions (the distance between substrate and ECR plasma source, Decr-s) were studied.
So far, at the ECR 2013 and ECR 2014 the relationship between radiology and nuclear medicine, and the position of ultrasound in radiology, were discussed, while the topic of "General radiologist versus subspecialist radiologist" was discussed at ECR 2015.
Although no significant difference was noticed among the growth performances and ECR induced by experimental diets (D2 D5), the diet D2 with a ratio 2 5 between earthworm and maggot may be considered the most efficient.
The use of N2 + 5% H2 rather than pure N2 as an ambient gas in the annealing process significantly improves the emission intensity in the ICP CVD- and ECR PECVD-deposited films.
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Controlling the temperature gradient direction can achieve both modes of CNTs by thermal CVD, MP-CVD and ECR-CVD.
The plasma-enhanced CVDs for CNTs deposition include MP-CVD and ECR-CVD with 2.45 GHz microwave and tunable DC bias.
To improve the understanding on CNT growth modes, the various processes, including thermal CVD, MP-CVD and ECR-CVD, have been used to deposit CNTs on nanoporous SBA-15 and Si wafer substrates with C2H2 and H2 as reaction gases.
The present research includes specially designed experiments, testing different processes (thermal CVD, MP-CVD and ECR-CVD) and substrates and varying the possible process parameters to examine their effects on CNT growth modes.
To test the effect of ΔT on the growth mode of CNTs deposited by plasma-enhanced CVD, the MP-CVD and ECR-CVD were used to grow CNTs under ΔT > 0 and ΔT < 0. In the case of plasma-enhanced CVD, the manipulation of ΔT is obtainable by using the scheme in Fig. 10, which shows the temperature variation during the process.
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